Immersion Cooling is a highly efficient liquid cooling technology in which IT equipment, such as servers, is directly submerged in a non-conductive dielectric coolant. Heat is dissipated through liquid circulation or phase change (vaporization). By eliminating the need for fans and heat sinks, it achieves exceptional energy efficiency, bringing the Power Usage Effectiveness (PUE) down to 1.03–1.05. This makes it ideal for high-density AI data centers and high-performance computing (HPC) centers.

We provide key solutions from semiconductor manufacturing and the chip level to system modules. Our product line covers advanced thermal management and specialty materials (such as TIM, diamond applications, EMI shielding, and specialty chemicals), semiconductor storage and controller chips, as well as various high-end connectors and electromechanical components. With high product integration and scalability, we extensively support cutting-edge fields including AI computing, semiconductor equipment, new energy, and high-frequency communications, meeting the market's diverse needs for high-performance computing, precise temperature control, and highly reliable connections.

We authorized distribute a comprehensive range of 3M industrial and medical single/double-sided tapes, engineered to meet diverse performance requirements including electrical conductivity, thermal management, high optical clarity, and electrical insulation.

We supply 3M industrial and medical-grade double-sided tapes with superior adhesion and weather resistance. Designed for seamless lamination on various substrates including metals and plastics, delivering high-efficiency bonding solutions.